HRSEM: Focused Ion Beam

ZEISS 1540XB CrossBeam

The Zeiss CrossBeam is an instrument that combines an ultra high resolution GEMINI field emission column with a high performance Canion FIB column in one integrated system. The 1540XB CrossBeam® workstation is the perfect solution for three-dimensional analysis with no compromises on SEM imaging capabilities. The unique live SEM imaging capability of the 1540XB CrossBeam® during FIB operation mode gives full control when analyzing critical samples. The superior super-eucentric stage with Windows® control system makes the 1540XB CrossBeam® a versatile research tool.

Using a focused Ga2+ ion beam, it can precisely remove or deposit material at the sample surface as well as image the sample surface producing high quality contrast images with high magnifications. Additionally, an EDAX/EDS-detector embedded at the Workstation enables qualitative and quantitative analysis of the material composition. Additionally, the 1540X is equipped with a heat/cooling-device what allows following the structure changing in the temperature range from -150 until +350°C.

Features of Zeiss HRSEM:

• Ultra high resolution FESEM with unique GEMINI column (electron beam source)
• High performance CANION FIB column (Ga2+ ion beam source)
• CrossBeam-operation: high resolution live imaging during milling and polishing
• Endpoint detection for automated milling
• Optional multi-channel gas injection system for 5 different gases allows material deposition and enhanced or selective etching
• Super eucentric - 6 axes, fully motorised stage for exact position of coincidence point
• Automated TEM preparation software package
• Two infra-red CCD chamber cameras for safe specimen handling and navigation

Applications

• Cross sections of e.g. thin films, multilayer systems or any structural elements of interest (e.g. investigation of interface processes)
• Etching and polishing of exact defined micro- or nano-surface areas (e.g. investigation of grain structure, failure analysis - voids, cracks, inclusions,..,).
• Cutting out of TEM thin foils
• Micro-structuring and prototyping of microsystems and electronic packages - deposition (e.g. W, Pt, Au or SiO2) and etching of defined shapes
• Qualitative and quantitative analysis using high resolution images and EDS-system.